Introducing 2023 Edge-Native AI Hackathon
Edge computing, including cloud provider regional data centers, communication service provider wired and wireless points of presence and on premises enterprise equipment continues to emerge with use cases that require workloads distributed from centralized data centers out to edge locations. The objective is to provide low latency response times, minimize bandwidth consumed transmitting data, and respecting data sovereignty, while dynamically optimizing placement of workloads. To make matters even more interesting AI workloads will be placed at the edge as well as within centralized data centers.

Join the Hackathon hosted by ETSI, OCP and LF Edge

For this reason, the OCP, LF Edge and ETSI have chosen edge native AI/HW/SW Co-design as the theme for an upcoming Hackathon. Three application vertical categories are especially relevant for Edge-Native design, use of AI, and HW/SW co-design:
- AI and Automation: How to utilize edge-native and AI into data analytics and automation?
- Sustainability: How is edge-native and AI useful to enhance sustainability in applications, services, and networks?
- 5G Edge: How to deploy and utilize AI in 5G edge infrastructure to enable edge-native distributed applications?

The Hackathon In-Person Event: 2023 OCP Global Summit

The three finalists of the Hackathon will be invited for the final in-person competition, to be held at the OCP Global Summit in San Jose on October 17-19. 

All details, winners’ prizes and link to the submission form are available at:


Submission Period OPEN: July 1
Submission Period CLOSED: July 21
Notifications of acceptance: July 24
Hackathon Start - Remote Competition: July 17 - September 15
Team Final Submission - September 15
Three finalist teams notified week of September 25
Hackathon in-person event at OCP Global Summit: October 17-19


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