ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform
I3C Interface for SSP provides higher data rate and improved integration flexibility with decreased power consumption
Piscataway, N.J. and Sophia Antipolis, France 30 June, 2022
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, and ETSI Technical Committee Secure Element Technologies (TC SET) today announced the adoption of the I3C Interface for SSP (ETSI TS 103 818) specification, allowing the MIPI I3C Basic specification to serve as a physical and logical link layer for the ETSI Smart Secure Platform (SSP). The I3C Interface for SSP joins the family of specifications that underpin the ETSI SSP, the next-generation platform for Universal Subscriber Identity Module (USIM) and Secure Elements to meet new market requirements driven by emerging Internet of Things (IoT), 5G and other security-sensitive applications.