Surface Mount Technique

Introduction

Many Machine-to-Machine applications – such as personal health monitoring, smart utility metering and ambient assisted living – rely on embedded communication modules that provide 2G, 3G or 4G connectivity over the cellular network.

These communications modules are different from the mobile phones we carry in our pocket. They have no screen or keyboard and provide mostly data communication. Depending on the application, they must be small and able to withstand extreme temperatures, vibrations or other physical conditions.

Many communications modules are now connected and attached using Surface Mount Technology (SMT), a manufacturing process whereby the module is soldered directly on the circuit board rather than through mechanical connectors. This offers significant advantages in terms of the cost and flexibility of the manufacturing process when integrating communications functionality into a larger device or system. But it also puts certain restrictions on the design of the module in terms of thermal properties, tolerance to interference etc.

Standardization will:

  • allow easier transition to next generation communication modules
  • ease development for device vendors through consistent designs
  • offer a second source option for integrators

Our Role & Activities

Our Industry Specification Group on Surface Mount Technique (ISG SMT) is working to establish common form factors and electrical characteristics for embedded Machine-to-Machine communication modules based on Surface Mount Technology.

In 2014 we completed a baseline specification describing the mechanical and electrical aspects of the modules.

This specification is now helping chipset manufacturers, module vendors, integrators and network operators create a market for communications modules that are cheaper, more versatile and easier to integrate.

The specification will also facilitate the evolution of commercial modules towards future radio technologies and data interfaces.

We are now updating the specification with additional form factors (both larger and smaller) and forward-looking electrical interfaces, and taking into account feedback received from the industry.

Specifications

The following is a list of the latest published ETSI standards on surface mount technique.

A full list of related standards in the public domain is accessible via the ETSI standards search. Via this interface you can also subscribe for alerts on updates of ETSI standards.

For work in progress see the ETSI Work Programme on the Portal.

Standard No. Standard title.
GS SMT 001 Surface Mount Technology (SMT); Requirements for Embedded Communication Modules For Machine To Machine Communications
GS SMT 001 Surface Mount Technology (SMT); Requirements for Embedded Communication Modules For Machine To Machine Communications